AN145: Determination of the Suppressor Additive in Acid Copper Plating Bath

Instrument Type: HPLC

Copper electroplating systems are used for the deposition of copper on semiconductor wafers. A proprietary suppressor additive is used to influence the quality of copper deposition. Because maintaining the level of the suppressor within the recommended operating range ensures the quality of the fill, we developed a method to determine the suppressor additive. This application note describes the use of the IonPac NS1 column with evaporative light-scattering detection to determine two different proprietary suppressors in acid copper plating baths.

AN139: Determination of Additives and Byproducts in an Acid Copper Plating Bath by Liquid Chromatography.

Instrument Type: HPLC

Copper electroplating systems are used for the deposition of copper on semiconductor wafers. The primary components of an acid copper plating bath are copper sulfate, sulfuric acid, and hydrochloric acid. As the bath ages, certain byproducts are formed as a result of the plating process. Tracking the levels of these components ensures the quality of the fill. Chromatography can be used to quantitatively measure individual components. This Application Note describes the use of the IonPac NS1 column with absorbance detection to determine additives and byproducts in acid copper plating baths.