AN145: Determination of the Suppressor Additive in Acid Copper Plating Bath

Instrument Type: HPLC

Copper electroplating systems are used for the deposition of copper on semiconductor wafers. A proprietary suppressor additive is used to influence the quality of copper deposition. Because maintaining the level of the suppressor within the recommended operating range ensures the quality of the fill, we developed a method to determine the suppressor additive. This application note describes the use of the IonPac NS1 column with evaporative light-scattering detection to determine two different proprietary suppressors in acid copper plating baths.

AN137: Determination of Trace Anions in High-Nitrate Matrices by Ion Chromatography.

Instrument Type: IC

A direct injection method has been developed to address the need to determine trace anions in samples containing high concentrations of nitrate ion using a microbore IonPac AS15 column. Conditions are optimized for sensitive determination of anions at trace levels with the EG40 Eluent Generator. This application note describes the theoretical background, setup, and analytical procedure for a method to determine chloride, sulfate, and phosphate to low-µg/L (ppb) levels in 0.7% (v/v) nitric acid and other matrices that contain high concentrations of nitrate ion.